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PRELIMINARY TECHNICAL DATA
a
Wideband, 43dB Isolation @ 1GHz, CMOS 1.65 V to 2.75V, 2:1 Mux/SPDT Switches ADG918/ADG919 Preliminary Technical Data
FUNCTIONAL BLOCK DIAGRAM
ADG918 RF1 RF COMMON 50 RF2 CONTROL 50
FEATURES Wideband DC to 2GHz ADG918/ADG919 Absorptive/Reflective Switches High Off Isolation (43 dB @ 1 GHz) Low Insertion Loss (1 dB DC to 900 MHz) Single 1.65 to 2.75 V power supply CMOS/LVTTL Control Logic 8 Lead MSOP & Tiny 3 x 3mm CSP Packages Low Power Consumption (5A) APPLICATIONS Wireless Communications General Purpose RF switching Dual Band Applications Filter Selection Antenna Switch Digital Transceiver Front-End Switch IF Switching GENERAL DESCRIPTION
ADG919 RF1 RF COMMON RF2 CONTROL
The ADG918/ADG919 are wideband switches using a CMOS process to provide high isolation and low insertion loss to 1GHz. The ADG918 is an absorptive switch having 50 ohm terminated shunt legs, while the ADG919 is a reflective switch. These devices are designed such that the isolation is high over the DC to 1GHz frequency range. They have on board CMOS control logic, thus eliminating the need for external controlling circuitry. The control inputs are both CMOS and LVTTL compatible. The low power consumption of these CMOS devices makes them ideally suited to wireless applications and general purpose high frequency switching.
Table 1. Truth Table
Control 0 1
Signal Path RF2 to RF Common RF1 to RF Common
Figure 1. Isolation vs Frequency
Figure 2. Loss vs Frequency
REV. PrC Sept 2002
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P Box 9106, Norwood, MA 02062-9106, U.S.A. .O. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 Analog Devices, Inc., 2002
PRELIMINARY TECHNICAL DATA
1 ADG918/ADG919-SPECIFICATIONSotherwise noted) (V = +1.65 V to +2.75 V, GND = 0 V, All specifications T to T unless
DD MIN MAX
Parameter AC ELECTRICAL CHARACTERISTICS Operating Frequency Insertion Loss
Symbol
Conditions
Min DC
B Version Typ 2
Max 2
Units GHz dB dB dB dB dB dB dB dB dB dB dB dB dB dB ns ns dBm dBm V V V V A pF pF
S21, S12
Isolation- RF to RF1/RF2
S21, S12
Isolation - RF1 to RF2
S21, S12
Return Loss (On Channel)
S11, S22
On switching Time Off Switching Time 1 dB Compression Third Order Intermodulation intercept DC ELECTRICAL CHARACTERISTICS Input High Voltage Input Low Voltage Input Leakage Current CAPACITANCE3 RF1/RF2, RF Port On Capacitance Control Input Capacitance POWER REQUIREMENTS VDD Quiescent Power Supply Current
tON t OFF P-1dB IP3 VINH VINH VINL VINL II CRF ON C IN
DC - 100 MHz 500 MHz 900 MHz 1 MHz 100 MHz 500 MHz 1000 MHz 1 MHz 100 MHz 500 MHz 1000 MHz DC - 100 MHz 500 MHz 1000 MHz 50% Control to 90% RF 50% Control to 10% RF DC to 1000 MHz 900MHz, 5dBm VDD = 2.3 V to 2.75 V VDD = 1.65 V to 1.95 V VDD = 2.3 V to 2.75 V VDD = 1.65 V to 1.95 V 0 VIN 2.75 V f = 1 MHz f = 1 MHz 1.65 1.7 0.65VCC
0.4 0.65 1.0 100 55 43 100 55 30 26 23 5 4 20 35
0.7 0.35VCC 1 2 2 2.75 5
IDD
Digital Inputs = 0 V or VDD
1
V A
NOTES 1 Temperature range is as follows: B Version: -40C to +85C. 2 Typical values are at +25C unless otherwise stated. 3 Guaranteed by design, not subject to production test. Specifications subject to change without notice.
-2-
REV. PrC
PRELIMINARY TECHNICAL DATA ADG918/ADG919
ABSOLUTE MAXIMUM RATINGS 1
(T A = +25C unless otherwise noted)
PIN CONFIGURATION
VDD to GND -0.5 V to +4 V Inputs to GND -0.5 V to VDD + 0.3V Input Power TBD dBm Operating Temperature Range Industrial (B Version) -40C to +85C Storage Temperature Range -65C to +150C Junction Temperature +150C MSOP Package 206C/W JA Thermal Impedance CSP Package TBDC/W JA Thermal Impedance Lead Temperature, Soldering (10seconds) 300C IR Reflow, Peak Temperature (<20 seconds) +235C
NOTES 1 Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
8-Lead MSOP (RM-8) 3x3mm CSP (CP-8)
VDD CONTROL 2 GND 3 RFCommon 4
1
8
RF1 GND GND RF2
ADG918/ ADG919
TOP VIEW (Not to Scale)
7 6 5
ORDERING GUIDE
Model ADG918BRM ADG918BCP ADG919BRM ADG919BCP
Temperature Range -40C -40C -40C -40C to to to to +85C +85C +85C +85C
Package Descriptions MSOP (Micro Small Outline Package) Chip Scale Package MSOP (Micro Small Outline Package) Chip Scale Package
Branding
Package Options RM-8 CP-8 RM-8 CP-8
CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG919 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
REV. PrC
-3-
PRELIMINARY TECHNICAL DATA ADG918/ADG919
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
MSOP (RM-8)
0.122 (3.10) 0.114 (2.90)
8
5
0.122 (3.10) 0.114 (2.90)
1 4
0.199 (5.05) 0.187 (4.75)
PIN 1 0.0256 (0.65) BSC 0.120 (3.05) 0.112 (2.84) 0.006 (0.15) 0.002 (0.05) 0.018 (0.46) SEATING 0.008 (0.20) PLANE 0.043 (1.09) 0.037 (0.94) 0.011 (0.28) 0.003 (0.08) 0.120 (3.05) 0.112 (2.84)
33 27
0.028 (0.71) 0.016 (0.41)
Chip Scale Package (CP-8) 3 x 3mm TBD
-4-
REV. PrC

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